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The Korean giant is reportedly considering a strategic partnership with Intel, driven by political aspirations, particularly in light of President Trump’s support for the US chipmaker.
### Samsung Could Form a Strategic Partnership With Intel
Intel has recently garnered significant interest from the US government, something unprecedented under any previous administration. After a long process, it was concluded that the Trump administration secured a 10% stake in Intel with specific conditions. Now, according to the Taiwan Economic Daily, citing Korean sources, Samsung is exploring partnerships with American companies like Intel to secure better trade terms with the Trump administration.
It is speculated that Samsung aims to form this strategic partnership to avoid tariffs and gain favor with President Trump. Given Intel’s importance to the current US administration, a deal could elevate Samsung’s status in Trump’s eyes. While details of such a partnership are uncertain, it could significantly impact their operations.
### Glass Substrates
In a previous report, we discussed how Intel is abandoning its pursuit of glass substrates. However, several engineers from Intel have moved to Samsung’s Electro-Mechanics division in the US because Samsung views glass substrates as crucial for its future. Since Intel plans to license this technology and produce end solutions, Samsung could play a key role by manufacturing these components, ultimately benefiting both companies through packaging technology.
Samsung’s chances of adopting Intel’s 18A processes are slim due to ongoing internal product development like Panther Lake. Moreover, given that Samsung is planning to produce up to 2nm nodes at its Taylor facility, there would be a conflict of interest in sourcing chips from Intel. However, a strategic partnership could still provide significant benefits for both companies.
In summary, President Trump’s support for Intel and Samsung’s need to avoid tariffs drive this potential partnership, which could reshape the tech landscape.