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In a presentation by Taiwan Microloops Corp during the OCP APAC Summit, the company showcased advanced liquid cooling solutions for next-generation servers. These include the upcoming SP7 platform, which will replace the current SP5 platform used in Genoa and Turin chips. The SP7 platform will house AMD’s next-gen EPYC Venice “Zen 6” and Verano CPUs, with the former expected to feature up to 256 cores.
Microloops has developed a new cold plate solution designed for kW-level cooling, specifically tailored for AMD’s SP7 socket. This solution supports power scaling from 700W to 1400W, significantly higher than the current EPYC Turin chips which max out at around 500W. The company also noted that certain configurations of Threadripper parts can reach over 1000W when pushed to their limits.
AMD’s EPYC Venice CPUs based on the Zen 6 core architecture will be the first to feature support on the SP7 platform, with a detailed launch expected in the coming year. These chips will compete with Intel’s Clearwater Forest Xeon E-Core and Diamond Rapids Xeon P-Core families.
The SP7 platform is designed to handle up to 1400W power consumption, making it suitable for high-performance computing applications that require significant cooling solutions. The cold plate features two ports, one inlet and one outlet, with a metal stiffener screwed into place and an acrylic cover for protection. It shares a similar configuration with the SP5 platform.
Overall, AMD is expected to update these CPUs with higher core counts and expanded IO capabilities, while still maintaining high power efficiency as seen in previous generations of EPYC CPUs.
