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Chinese memory manufacturers are reportedly collaborating for high-bandwidth memory (HBM) production. Notably, the prominent NAND firm YMTC has partnered with CXMT to develop HBM3 and beyond.
#### Chinese Memory Manufacturers Collaborate for Next-Gen Technologies
China is aiming for complete self-reliance in manufacturing. CXMT, a leading entity in HBM, mass-produces HBM2 and is reportedly advancing towards HBM3 rapidly. According to a report by ZDNet Korea, CXMT has partnered with YMTC, a renowned NAND manufacturer, to develop advanced DRAM technologies that support superior HBM solutions.
YMTC plans to invest in the DRAM segment soon, setting up related technologies to push itself towards HBM production. The firm is reportedly ordering DRAM R&D equipment and intends to collaborate with CXMT for this purpose. CXMT is known as China’s largest DRAM manufacturer and specializes in producing up to HBM2.
### Partnership Details
YMTC expects CXMT to provide hybrid bonding technologies, which will accelerate the development of DRAM-based HBM solutions. The primary focus is on scaling production capacity. Before US export controls, YMTC was one of the largest NAND producers and has collaborated with Samsung, indicating its capabilities to address HBM production bottlenecks in the region.
This partnership could pose a threat to South Korean competitors like Samsung, despite their lead in IPs and technologies. Establishing sufficient semiconductor and HBM production lines is a priority for China as it aims to adopt a domestic AI tech stack.
### Conclusion
The partnership between YMTC and CXMT highlights China’s ambitions in the DRAM market and its efforts to reduce dependency on foreign technology.
