Xiaomi’s Next Big Watch Rumored for 2026: TSMC 3nm Tech Details

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The success of the XRING 01 and how Xiaomi’s first in-house 3nm chipset held its own against the competition indicated that a successor was inevitable. However, as TSMC reportedly begins mass production of 2nm wafers in the fourth quarter of 2025, many competitors will shift to this technology. To keep up with its rivals, Xiaomi’s XRING 02 would need to follow suit. Unfortunately, a new rumor suggests that Xiaomi will stick with TSMC’s 3nm process, making the XRING 02 an entire generation behind the competition.

Increased 2nm wafer prices could be a major reason why Xiaomi’s XRING 02 sticks with the 3nm process, with the lack of specialized equipment being another factor

The ‘XRING 02’ trademark was filed earlier this year, indicating that Xiaomi intended to launch the XRING 01’s successor in the future. According to MyDrivers, the Xiaomi 16S Pro is expected to feature the new silicon but will be mass produced on TSMC’s 3nm instead of the cutting-edge 2nm node. Given that the XRING 01 was fabricated on the second-generation 3nm ‘N3E’ technology, it’s likely that the Taiwanese semiconductor giant’s third-generation 3nm ‘N3P’ will be used.

Although this step means that the XRING 02 will not share the same technological level as its competitors launching in Q4 2026, cost considerations are significant. It is estimated that each of TSMC’s 2nm wafers costs $30,000 apiece, and companies must spend millions during the tape-out phase to ensure their test silicon performs as expected.

While the XRING 02 will give Xiaomi more reason to reduce its dependency on Qualcomm and MediaTek, various factors might have forced the company to stick with the 3nm process. One of these is the U.S. export controls that limited the supply of advanced EDA tools for Chinese companies. Without this specialized equipment, Xiaomi has little chance to develop a 2nm chip.

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October 8, 2025

Additionally, the XRING 02 is not just reported to be found in smartphones and tablets but is also evaluated for use in cars and other applications. The intricate backend process required to integrate the XRING 02 into a variety of products will not just strain Xiaomi’s finances but also increase development time, potentially resulting in the chipset arriving later than anticipated. It is important to remember that the company’s decision might change in the future, and if that happens, we will update our readers accordingly.

News Source: MyDrivers