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As TSMC prepares for 2nm wafer production in the final quarter of this year, Apple has reportedly secured nearly half of the initial capacity. The company is not just focusing on the A20 and A20 Pro chipsets for the iPhone 18 family in 2026; it’s also preparing four System-on-Chip (SoC) designs that will be mass-produced using advanced lithography technology. Additionally, Apple is expected to introduce a new packaging method that will likely be an upgrade from its current systems.
A20, A20 Pro Expected to Adopt the Newer WMCM Packaging; New MacBook Pro and Apple Vision Pro Are Also Expected to Feature a 2nm Silicon
Apart from Apple, Qualcomm and MediaTek are expected to introduce their first 2nm chipsets in 2026. However, Apple is likely to have an advantage because this technology will be adopted across many of its products. According to China Times, the A20 and A20 Pro are expected to use most of TSMC’s initial 2nm capacity, and Apple has previously been reported to adopt the advanced WMCM (Wafer-Level Multi-Chip Module) packaging.
WMCM packaging technology allows companies like Apple to integrate different components while maintaining a small footprint for the chipset. Components such as the CPU, GPU, DRAM, and more can be integrated on a smaller package, creating a more powerful and efficient design that leads to better performance, reduced thermal issues, and increased battery life. Similar to the A19 and A19 Pro, we expect Apple to unveil three versions of the A20 instead of two, with the ‘Pro’ variant likely receiving the binning treatment.
You can read more about the differences between the A19, binned A19 Pro, and non-binned A19 Pro here. As for other 2nm chipsets, a new MacBook Pro lineup will be equipped with the M6. Various reports suggest that this series could replace mini-LED with OLED displays. The report also indicates that an Apple Vision Pro successor is not expected to launch in 2026 but rather in 2027, where its R2 co-processor will utilize TSMC’s 2nm process.
Interestingly, there is no mention of which primary SoC will be found in the headset’s innards, but we will likely find out in the coming weeks. TSMC’s 2nm technology seems to be highly sought after, with the company estimated to produce about 100,000 monthly wafer units by the end of 2026 to meet rising demand. This will be TSMC’s most expensive manufacturing process, costing approximately $30,000 per wafer, resulting in a significant financial burden for its partners.
News Source: China Times
