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Intel confirms that its plans for glass substrates continue as per the company’s roadmap. The firm has denied reports suggesting commercialization or complete abandonment of this technology.
**Intel’s Glass Substrate Development Will Continue According to Plans; No Licensing to Samsung for Now**
For those unfamiliar, glass substrates are used in packaging solutions to replace organic materials. They offer significant benefits, such as higher packaging strength ensuring durability and reliability, and a greater interconnected density due to their thinner nature compared to organic materials.
Given the importance of advanced packaging equipment in modern technology, Intel had been leading R&D efforts with glass substrates until recent slowdowns compromised progress. Recent coverage suggested key individuals from Intel’s glass substrate projects were leaving to work with Samsung’s Electro-Mechanics division, creating the impression that Intel might abandon the project. However, a report by ETNews states that Team Blue has not altered its plans and remains fully committed.
> There are no changes to the semiconductor glass substrate development plan as announced in 2023.
It was also rumored that Intel could partner with Samsung to license its glass substrate technology for production of end solutions, given the high costs involved in setting up manufacturing facilities. However, Intel’s recent statement indicates consistent plans for now, which is optimistic considering the critical role glass substrates play in packaging technologies.
Intel continues to navigate market uncertainties but appears resolute in turning things around. Ensuring it capitalizes on future technologies, such as glass substrates, will be crucial.
*Image Credit: Intel*
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