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Smartphone DRAM and memory manufacturers are researching to develop faster, more efficient chips for on-device AI applications and to address performance throttling issues. SK hynix, which has surpassed Samsung in memory technology advancements, has begun supplying a new form of mobile DRAM that uses an industry-first ‘Molding Compound’ designed to reduce overheating. The company claims the thermal conductivity of these latest memory chips has improved by 350 percent.
The new material used on SK hynix’s mobile DRAM is called ‘High-K Epoxy Molding Compound’. With this improvement, SK hynix says that the thermal resistance in smartphones has reduced by 47 percent. In many smartphone designs, mobile DRAM is stacked above the chipset die, which can cause performance degradation during intense workloads due to excessive heat. However, this design frees up space and improves data transfer between the DRAM and the chipset.
Using High-K Epoxy Molding Compound, SK hynix claims that smartphones equipped with these memory chips will deliver better battery life while improving overall performance. Lee Gyu-jei, head of Package Product Development at SK hynix, calls this a ‘meaningful achievement’ and says it addresses many issues faced by flagship smartphone users.
“Improving thermal conductivity is not just about performance; it also solves the inconvenience that high-performance smartphone users may have experienced,” he states. “We are committed to establishing our technological leadership in the next-generation mobile DRAM market through our material innovations.”
According to The Korea Herald, SK hynix improved thermal conductivity by adding Alumina to Silica and incorporating this into Epoxy Molding Compound for better heat transfer. There is no specific timeline for when these new memory chips will be available, but it’s possible that 2026 flagship smartphones may incorporate this technology.
News Source: SK hynix
