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To address these concerns, a new report indicates that the iPhone 17 Air will incorporate a technology called ‘Copper Post.’ This innovation allows for the production of components up to 20 percent smaller by using copper posts instead of solder balls. LG Innotek developed this technology and is expected to commercially use it in the upcoming flagship device.
‘Copper Post’ works by erecting copper posts and placing semicircular solder balls on top, which helps reduce both area and size. This advancement enables Apple to maintain performance while significantly reducing the thickness of devices like the iPhone 17 Air without compromising thermal management. Interestingly, this technology was first introduced on the ‘communication hip’ of the iPhone 16e earlier this year.
The same miniaturization technique might also be applied to future foldable iPhones, allowing for a slimmer form factor while ensuring effective heat dissipation. While these changes aim to improve performance and aesthetics, it remains to be seen whether they will be superior alternatives to the vapor chamber coolers used in the iPhone 17 Pro and iPhone 17 Pro Max.
**News Source:** [Joongang](https://www.joongang.co.kr/article/25362212)
