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One of our previous posts speculated about a new Ryzen 9000X3D CPU, which was described as the first chip with dual X3D chiplets for both Core Complexes (CCDs). However, another Chiphell user has stated that this report is inaccurate and such a CPU does not exist. Another rumored X3D Ryzen 9000 chip, a sibling of the Ryzen 7 9800X3D, might be in development.
The Chiphell user mentioned that if this CPU were to release next year, it would likely have lower thermal design power (TDP) due to slower clock speeds compared to the 9800X3D. In performance terms, the rumored 9700X3D could match the 9800X3D, especially in gaming scenarios.
According to 3DCenter, a dual X3D variant might only provide up to a 4% performance boost over the Ryzen 9 9950X3D. This small improvement does not justify the cost increase and could potentially affect latency-sensitive applications, reducing overall benefits. Therefore, for the Zen 6 lineup, dual X3D CPUs may make more sense, but for the Ryzen 9000 series, such configurations would likely be unbeneficial.
For further information, refer to this Chiphell post:
📚 Reading Comprehension Quiz
According to the Chiphell user, what is a potential downside of the rumored dual X3D variant for the Ryzen 9000 series?
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